SPI NOR / NAND Flash Selection & Replacement Guide
3V standard, 1.8V low-voltage, or SPI NAND — pick by density and voltage
Serial Flash selection comes down to three things: density, supply voltage (3V vs 1.8V), and NOR (code/small) vs NAND (large data). GigaDevice GD25/GD5F use standard JEDEC pinouts and commands, a common second source for Winbond W25Q, Macronix MX25L, ISSI, Puya, and more. Organized by category below.
① 3V standard SPI NOR (the W25Q second source)
Standard JEDEC pinout and command set — the go-to for code storage and boot flash.
8Mbit, replaces W25Q80.
64Mbit, mainstream density.
128Mbit, replaces W25Q128.
② 1.8V low-voltage SPI NOR (wearable/IoT)
For 1.8V-rail low-power designs — do not mix with 3V parts.
128Mbit 1.8V, matches W25Q128JW.
32Mbit 1.8V low-voltage.
③ SPI NAND (large data storage)
When density outgrows NOR, use SPI NAND with on-die ECC.
1Gbit SPI NAND.
2Gbit SPI NAND.
Cross-references
Related guides
Frequently asked questions
Can GD25Q directly replace W25Q? ▾
Yes — both are JEDEC-standard SPI NOR with the same pinout/commands and QE-bit; same density swaps directly. The only caveat: update firmware that hard-codes the JEDEC ID (Winbond EFh, GigaDevice C8h).
Which part for a 1.8V design? ▾
Choose the GD25LE series (1.8V), e.g. the GD25LE128E matches the 1.8V W25Q128JW; never substitute a 3V part for 1.8V or apply 3.3V.
NOR or NAND — how to choose? ▾
For small density and execute-in-place (XIP) code use NOR (GD25Q/GD25LE); for large data logging beyond the NOR sweet spot use SPI NAND (GD5F), which requires ECC/bad-block handling.
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