JL
JLink Technology 傑聯特科技
RFQ
SPI NAND Flash

W25N01 / W25N02 (SPI NAND) GD5F1GQ / GD5F2GQ

Cross-reference / replacement · Winbond → GigaDevice

Original part
W25N01 / W25N02 (SPI NAND)
Winbond
JLink replacement
GD5F1GQ / GD5F2GQ
Software-compatible
Density:
1 Gbit
Page / Block:
2 KB page / 128 KB block
Interface:
SPI x1/x2/x4 (Quad)
ECC:
On-chip (UE) / ECC-free (RE)

Compatibility & sourcing notes

Both are SPI NAND with the same command framework, page size, and WSON-8 footprint, but not a transparent drop-in: Winbond and GigaDevice differ in on-die ECC strength, ECC-status bit encoding, spare-area parity layout, and bad-block/OTP handling, so the MTD/flash driver and ECC-status parsing must be adapted. Verify ECC config, spare-area map, bad-block scheme, voltage, and timing per datasheet.

Registers and interface are similar and firmware largely ports, but the package/pinout differs — re-layout and validate in your design.

Frequently asked questions

Can GD5F1GQ / GD5F2GQ replace the W25N01 / W25N02 (SPI NAND)?

Both are SPI NAND with the same command framework, page size, and WSON-8 footprint, but not a transparent drop-in: Winbond and GigaDevice differ in on-die ECC strength, ECC-status bit encoding, spare-area parity layout, and bad-block/OTP handling, so the MTD/flash driver and ECC-status parsing must be adapted. Verify ECC config, spare-area map, bad-block scheme, voltage, and timing per datasheet.

What should I check when replacing the W25N01 / W25N02 (SPI NAND)?

Registers and interface are similar and firmware largely ports, but the package/pinout differs — re-layout and validate in your design.

Is the GD5F1GQ / GD5F2GQ in stock, and can I get a quote?

JLink Technology is an authorized distributor and supplies GD5F1GQ / GD5F2GQ with stock, pricing, and lead time. Click "Request a Quote" with your quantity and we reply within one business day.

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